2048x2048 HgCdTe FPA

Rockwell has begun developing infrared FPAs in the 2048 format. The first is the HAWAII-2, an infrared 2048 focal plane array (FPA) for next-generation infrared astronomy. It will supplant our HAWAII 1024 as the largest high-performance infrared imager available. As with our prior infrared FPAs, the flip-chip hybrid will consist of a low dark current, low-capacitance HgCdTe detector array mated to a low-noise CMOS silicon multiplexer via indium interconnects. The FPA’s 18 μm pixel pitch accommodates both reasonable telescope optics and fabrication of the large, low-noise readout (≈40 x 40 mm) using world-class submicron CMOS.